The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 02, 2025

Filed:

Jun. 01, 2023
Applicant:

Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;

Inventors:

Chun-Yen Lin, Hsinchu, TW;

Wei-Cheng Lin, Taichung, TW;

Jiann-Tyng Tzeng, Hsinchu, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10D 84/03 (2025.01); H10D 30/67 (2025.01); H10D 84/01 (2025.01); H10D 84/83 (2025.01);
U.S. Cl.
CPC ...
H10D 84/038 (2025.01); H10D 30/6735 (2025.01); H10D 84/013 (2025.01); H10D 84/0151 (2025.01); H10D 84/83 (2025.01);
Abstract

A method includes: forming a first channel structure through a first gate structure; forming a first source/drain structure coupled to the first channel structure at a first surface of the first gate structure; before the first source/drain structure is formed, forming a first isolation layer at a second surface of the first gate structure to isolate the first channel structure; and after the first source/drain structure is formed, forming a first insulation structure at a position of the first isolation layer. The first surface and the second surface are opposite to each other, and a size of the first insulation structure is equal to or larger than a size of the first source/drain structure.


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