The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 02, 2025

Filed:

Jun. 16, 2021
Applicant:

Intel Corporation, Santa Clara, CA (US);

Inventors:

Telesphor Kamgaing, Chandler, AZ (US);

Neelam Prabhu Gaunkar, Chandler, AZ (US);

Georgios C. Dogiamis, Chandler, AZ (US);

Johanna M. Swan, Scottsdale, AZ (US);

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01P 3/16 (2006.01); H01L 21/48 (2006.01); H01L 23/14 (2006.01); H01L 23/15 (2006.01); H01L 23/498 (2006.01); H01L 23/66 (2006.01); H01P 11/00 (2006.01); H01Q 1/22 (2006.01); H01Q 9/04 (2006.01);
U.S. Cl.
CPC ...
H01P 3/16 (2013.01); H01L 21/486 (2013.01); H01L 23/147 (2013.01); H01L 23/15 (2013.01); H01L 23/49827 (2013.01); H01L 23/49838 (2013.01); H01L 23/66 (2013.01); H01P 11/006 (2013.01); H01Q 1/2283 (2013.01); H01Q 9/0407 (2013.01); H01L 2223/6616 (2013.01); H01L 2223/6627 (2013.01); H01L 2223/6677 (2013.01);
Abstract

Embodiments described herein may be related to apparatuses, processes, and techniques related to contactless transmission within a package that combines radiating elements with vertical transitions in the package, in particular to a waveguide within a core of the package that is surrounded by a metal ring. A radiating element on one side of the substrate core and above the waveguide surrounded by the metal ring communicates with another radiating element on the other side of the substrate core and below the waveguide surrounded by the metal ring. Other embodiments may be described and/or claimed.


Find Patent Forward Citations

Loading…