The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 02, 2025

Filed:

Dec. 07, 2020
Applicant:

Ebara Corporation, Tokyo, JP;

Inventor:

Tomoatsu Ishibashi, Tokyo, JP;

Assignee:

EBARA CORPORATION, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B08B 3/02 (2006.01); B08B 1/14 (2024.01); B08B 1/34 (2024.01); B08B 1/52 (2024.01); B08B 13/00 (2006.01); B24B 31/02 (2006.01); B24B 51/00 (2006.01); G05B 13/02 (2006.01); G06T 7/00 (2017.01); H04N 23/695 (2023.01);
U.S. Cl.
CPC ...
B24B 51/00 (2013.01); B08B 1/14 (2024.01); B08B 1/34 (2024.01); B08B 1/52 (2024.01); B08B 3/02 (2013.01); B08B 13/00 (2013.01); B24B 31/02 (2013.01); G05B 13/028 (2013.01); G06T 7/0002 (2013.01); H04N 23/695 (2023.01);
Abstract

The invention relates to a substrate cleaning apparatus, a polishing apparatus, a buffing apparatus, a substrate processing apparatus, a machine learning apparatus used for any of these apparatuses, and a substrate cleaning method, with improved performance and throughput. The substrate cleaning apparatus includes: a cleaning tool configured to clean a substrate held by a substrate holder; a surface-property measuring device configured to obtain surface data of the cleaning tool; and a controller configured to determine a replacement time of the cleaning tool based on the surface data. The surface-property measuring device is configured to obtain surface data of the cleaning tool at at least two measurement points of the cleaning tool each time a predetermined number of substrates are scrubbed, and the controller is configured to determine the replacement time of the cleaning tool based on a difference in the surface data obtained.


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