The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 25, 2025

Filed:

Apr. 01, 2024
Applicant:

Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;

Inventors:

Sheng-Chun Yang, Tainan, TW;

Chih-Lung Cheng, Tainan, TW;

Yi-Ming Lin, Tainan, TW;

Po-Chih Huang, Tainan, TW;

Yu-Hsiang Juan, Taichung, TW;

Xuan-Yang Zheng, Tainan, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C23C 16/44 (2006.01); C23C 8/24 (2006.01); C23C 14/50 (2006.01); C23C 16/458 (2006.01); F15D 1/02 (2006.01); H01J 37/32 (2006.01); H01L 21/67 (2006.01); H01L 21/683 (2006.01);
U.S. Cl.
CPC ...
H01L 21/67017 (2013.01); C23C 8/24 (2013.01); C23C 14/50 (2013.01); C23C 16/4401 (2013.01); C23C 16/4412 (2013.01); C23C 16/4583 (2013.01); C23C 16/4586 (2013.01); F15D 1/025 (2013.01); H01J 37/32715 (2013.01); H01J 37/32807 (2013.01); H01J 37/32816 (2013.01); H01J 37/32834 (2013.01); H01L 21/6838 (2013.01);
Abstract

A gas flow accelerator may include a body portion, and a tapered body portion including a first end integrally formed with the body portion. The gas flow accelerator may include an inlet port connected to the body portion and to receive a process gas to be removed from a semiconductor processing tool by a main pumping line. The semiconductor processing tool may include a chuck and a chuck vacuum line to apply a vacuum to the chuck to retain a semiconductor device. The tapered body portion may be configured to generate a rotational flow of the process gas to prevent buildup of processing byproduct on interior walls of the main pumping line. The gas flow accelerator may include an outlet port integrally formed with a second end of the tapered body portion. An end portion of the chuck vacuum line may be provided through the outlet port.


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