The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 25, 2025
Filed:
Oct. 02, 2023
Applicant:
Shin-etsu Chemical Co., Ltd., Tokyo, JP;
Inventors:
Atsushi Yoshida, Joetsu, JP;
Naruhiro Hoshino, Joetsu, JP;
Masahiko Ishida, Joetsu, JP;
Takeshi Aoyama, Joetsu, JP;
Assignee:
SHIN-ETSU CHEMICAL CO., LTD., Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C01B 33/035 (2006.01);
U.S. Cl.
CPC ...
C01B 33/035 (2013.01); C01P 2002/60 (2013.01); C01P 2004/02 (2013.01);
Abstract
A polysilicon rod wherein in an area whose distance from a center of a cross section of the polysilicon rod is within ⅔ of a radius and that excludes a seed core, average grain boundary characteristics have following features: a coincidence grain boundary ratio exceeds 20%, a grain boundary length exceeds 550 mm/mm, and a random grain boundary length does not exceed 800 mm/mm.