The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 18, 2025

Filed:

Mar. 17, 2022
Applicant:

Taiwan Semiconductor Manufacturing Company Ltd., Hsinchu, TW;

Inventors:

Sung-Hsin Yang, Tainan, TW;

Jung-Chi Jeng, Tainan, TW;

Ru-Shang Hsiao, Hsinchu County, TW;

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H10F 39/00 (2025.01); H10F 39/18 (2025.01);
U.S. Cl.
CPC ...
H10F 39/014 (2025.01); H10F 39/18 (2025.01); H10F 39/802 (2025.01); H10F 39/8037 (2025.01);
Abstract

A semiconductor image-sensing structure includes a semiconductor substrate having a sensor region and a circuitry region, a plurality of fin structures disposed in the circuitry region, a mesa structure disposed in the sensor region, a first gate structure disposed over the plurality of fin structures in the circuitry region, and a second gate structure disposed over the mesa structure in the sensor region. The plurality of fin structures and the mesa structure include a same semiconductor material.


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