The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 18, 2025

Filed:

May. 31, 2022
Applicant:

Micron Technology, Inc., Boise, ID (US);

Inventors:

Yifen Liu, Meridian, ID (US);

Xin Lan, Singapore, SG;

Byeung Chul Kim, Boise, ID (US);

Ye Xiang Hong, Singapore, SG;

Yun Huang, Singapore, SG;

Sok Han Wong, Singapore, SG;

Assignee:

Micron Technology, Inc., Boise, ID (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/11578 (2017.01); H10B 43/10 (2023.01); H10B 43/20 (2023.01); H10D 62/10 (2025.01);
U.S. Cl.
CPC ...
H10B 43/20 (2023.02); H10B 43/10 (2023.02); H10D 62/115 (2025.01);
Abstract

An electronic device includes a stack structure including vertically alternating dielectric materials and conductive materials, the conductive materials including first regions and second regions, and pillars extending vertically through the stack structure, the pillars adjacent to the second regions of the conductive materials. The pillars include cell films adjacent to the second regions, the cell films including a high-k dielectric material, a barrier oxide material, a storage node material, a tunneling material, and a channel material. Segments of each of the high-k dielectric material, the barrier oxide material, and the storage node material are adjacent to the second regions. A length of the segments of high-k dielectric material and a length of the segments of storage node material adjacent to the second regions are greater than a height of the first regions of the conductive materials. Related methods and systems are also disclosed.


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