The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 11, 2025
Filed:
Jun. 28, 2023
Applied Materials, Inc., Santa Clara, CA (US);
Kyle M. Hanson, Kalispell, MT (US);
Eric J. Bergman, Kalispell, MT (US);
Gregory J. Wilson, Kalispell, MT (US);
Paul R. Mchugh, Kalispell, MT (US);
Benjamin Clay Bradley, Kalispell, MT (US);
Aaron Paul Juntunen, Kalispell, MT (US);
Deepak Saagar Kalaikadal, Kalispell, MT (US);
Daniel Durado, Kalispell, MT (US);
Carl Campbell Stringer, Whitefish, MT (US);
James Jay Tripp, Kalispell, MT (US);
Jason A. Rye, Kalispell, MT (US);
John L. Klocke, Kalispell, MT (US);
Applied Materials, Inc., Santa Clara, CA (US);
Abstract
Method and systems for cleaning and wetting a semiconductor substrate, are provided. Methods and systems include forming an atmosphere in a basin housing the semiconductor substrate with a gas having a higher solubility in a wetting agent than oxygen. Methods and systems include spraying the wetting agent with a spray head onto the substrate while maintaining the atmosphere. Methods and systems include rotationally translating the semiconductor substrate, the spray head, or both the semiconductor substrate and the spray head, Methods and systems include wetting a plurality of features defined in the substrate.