The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 04, 2025

Filed:

May. 12, 2021
Applicant:

Ebara Corporation, Tokyo, JP;

Inventors:

Masayoshi Imai, Tokyo, JP;

Mitsuru Miyazaki, Tokyo, JP;

Assignee:

EBARA CORPORATION, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/67 (2006.01); H01L 21/02 (2006.01); H01L 21/687 (2006.01);
U.S. Cl.
CPC ...
H01L 21/67034 (2013.01); H01L 21/02057 (2013.01); H01L 21/67051 (2013.01); H01L 21/68785 (2013.01);
Abstract

The present invention relates to a substrate processing apparatus for processing a substrate. The substrate processing apparatus () includes a controller (). The controller () rotates the substrate (W) at a second speed, after rotating the substrate (W) at a first speed. The controller () supplies a dry fluid from a dry fluid nozzle () onto the substrate (W) for predetermined time after rotating the substrate (W) at the second speed, and while rotating the substrate (W) at a third speed. The controller () moves a dry fluid nozzle () from a center of the substrate (W) toward a peripheral portion of the substrate (W) while continuing to supply the dry fluid from the dry fluid nozzle ().


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