The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 04, 2025

Filed:

Feb. 03, 2023
Applicant:

Applied Materials, Inc., Santa Clara, CA (US);

Inventors:

Yan Zhang, Westford, MA (US);

Johannes M. Van Meer, Middleton, MA (US);

Jae Young Lee, Bedford, MA (US);

Naushad Variam, Marblehead, MA (US);

Assignee:

Applied Materials, Inc., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/265 (2006.01); H01L 21/306 (2006.01); H01L 21/768 (2006.01);
U.S. Cl.
CPC ...
H01L 21/26506 (2013.01); H01L 21/30625 (2013.01); H01L 21/76898 (2013.01);
Abstract

A method of processing a workpiece that will include a backside power delivery network is disclosed. The method includes forming a CMP marker layer in the workpiece at the depth to which the workpiece is to be thinned. This CMP marker layer, which may be a boron-rich layer, serves to slow the chemical-mechanical planarization (CMP) process. To minimize the diffusion of boron in this boron-rich layer, the boron-rich layer is sandwiched by implants of a first species of ions, where this first species of ions serves to slow the diffusion of the boron. In certain embodiments, carbon is used as the first species of ions.


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