The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 21, 2025

Filed:

May. 17, 2023
Applicant:

Enkris Semiconductor, Inc., Jiangsu, CN;

Inventors:

Liyang Zhang, Jiangsu, CN;

Kai Cheng, Jiangsu, CN;

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H10H 20/815 (2025.01); H10H 20/01 (2025.01); H10H 20/812 (2025.01); H10H 20/819 (2025.01); H10H 20/824 (2025.01); H10H 20/831 (2025.01); H10H 29/14 (2025.01);
U.S. Cl.
CPC ...
H10H 20/815 (2025.01); H10H 20/0133 (2025.01); H10H 20/812 (2025.01); H10H 20/819 (2025.01); H10H 20/824 (2025.01); H10H 20/8312 (2025.01); H10H 29/142 (2025.01);
Abstract

The present application discloses a semiconductor structure including: a base, the base being made of an amorphous material and including at least one trench; a monocrystalline layer, at least part of the monocrystalline layer being provided in the trench; and an epitaxial structure layer, located on the side of the monocrystalline layer away from the base. The semiconductor structure disclosed in the present application includes the monocrystalline layer formed in the at least one trench of the base, and an amorphous material with a thermal expansion coefficient similar to that of the monocrystalline layer is selected as the base, which can relieve the tensile stress generated by the monocrystalline layer during the epitaxial process. At the same time, the epitaxial structure layer is grown on an independent monocrystalline layer, and the size is small, which alleviates the problem of semiconductor film cracking on the large-size substrate.


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