The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 14, 2025

Filed:

Sep. 19, 2022
Applicant:

Globalfoundries U.s. Inc., Malta, NY (US);

Inventor:

Nan Wu, Dresden, DE;

Assignee:

GlobalFoundries U.S. Inc., Malta, NY (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H10D 30/60 (2025.01); H01L 21/225 (2006.01); H01L 21/28 (2025.01); H01L 21/285 (2006.01); H01L 21/74 (2006.01); H10D 30/01 (2025.01); H10D 62/17 (2025.01); H10D 64/01 (2025.01); H10D 64/27 (2025.01); H10D 64/62 (2025.01);
U.S. Cl.
CPC ...
H10D 30/611 (2025.01); H01L 21/2252 (2013.01); H01L 21/28114 (2013.01); H01L 21/28518 (2013.01); H01L 21/743 (2013.01); H10D 30/023 (2025.01); H10D 62/371 (2025.01); H10D 62/378 (2025.01); H10D 64/01 (2025.01); H10D 64/021 (2025.01); H10D 64/518 (2025.01); H10D 64/62 (2025.01);
Abstract

Disclosed is a structure including a field effect transistor (FET). The FET includes, on an insulator layer above a substrate, source/drain regions and a section of a semiconductor layer extending laterally between the source/drain regions. A primary gate structure is made of the insulator layer and a well region in the substrate opposite at least the section of the semiconductor layer extending laterally between the source/drain regions. One or two secondary gate structures are on the semiconductor layer between and near one or both of the source/drain regions, respectively. The FET can further include a patterned conformal dielectric layer, which is on the center of the semiconductor layer between the source/drain regions, and which extends onto the secondary gate structure(s). Also disclosed are methods of operating the structure by biasing the secondary gate structure(s) to adjust the effective gate length of the FET and methods of forming the structure.


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