The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 14, 2025
Filed:
Mar. 23, 2020
Applicant:
Lam Research Corporation, Fremont, CA (US);
Inventors:
Hui Ling Han, Alameda, CA (US);
Seetharaman Ramachandran, San Jose, CA (US);
Assignee:
LAM RESEARCH CORPORATION, Fremont, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01J 37/32 (2006.01); H01L 21/687 (2006.01);
U.S. Cl.
CPC ...
H01J 37/32642 (2013.01); H01J 37/32082 (2013.01); H01L 21/68735 (2013.01); H01J 2237/024 (2013.01); H01J 2237/24578 (2013.01); H01J 2237/24585 (2013.01); H01J 2237/334 (2013.01);
Abstract
A substrate processing system includes a substrate support assembly to support a semiconductor substrate during processing of the semiconductor substrate in the substrate processing system. A first edge ring is arranged around the substrate support assembly. The first edge ring is movable relative to the substrate support assembly. A second edge ring is arranged around the substrate support assembly and under the first edge ring. A controller is configured to compensate a height of the first edge ring based on erosion of the first and second edge rings.