The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 14, 2025
Filed:
Apr. 03, 2020
Dupont Electronics, Inc., Wilmington, DE (US);
Rohm and Haas Electronic Materials Llc, Marlborough, MA (US);
Husnu Alp Alidedeoglu, New Albany, OH (US);
Patricia Gumbley, Marlborough, MA (US);
Cecilia Hall, Marlborough, MA (US);
Joseph Casey Johnson, Pickerington, OH (US);
Benjamin Naab, Marlborough, MA (US);
Jaclyn Murphy, Marlborough, MA (US);
Grzegorz Slawinski, Fairborn, OH (US);
Christopher Dennis Simone, Pickerington, OH (US);
Catherine R Mulzer, Marlborough, MA (US);
Abstract
In a first aspect, a metal-clad polymer film includes a polymer film adhered to a first metal layer. The root-mean-square roughness (S) of the interface between the polymer film and the first metal layer is less than 1 μm. The peel strength between the polymer film and the first metal layer is greater than 5 N/cm after 168 hours of aging at 150° C. when tested for a polymer film having a thickness in the range of from 25 to 75 μm and a first metal layer having a thickness of 18 μm in accordance with IPC-TM-650 test methods. The thickness of the first metal layer is 12 μm or less. The polymer film includes a first thermoplastic polyimide layer. In a second aspect, an electronic device includes the metal-clad polymer film of the first aspect. In a third aspect a process includes for forming a double-sided metal-clad polymer film.