The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 07, 2025
Filed:
Jul. 28, 2022
The Government of the United States of America, As Represented BY the Secretary of the Navy, Arlington, VA (US);
Travis J. Anderson, Alexandria, DC (US);
Mona A. Ebrish, Alexandria, VA (US);
Andrew D. Koehler, Alexandria, VA (US);
Alan G. Jacobs, Rockville, MD (US);
Matthew A. Porter, Virginia Beach, VA (US);
Karl D. Hobart, Alexandria, VA (US);
Prakash Pandey, Toledo, OH (US);
Tolen Michael Nelson, Tecumseh, MI (US);
Daniel G. Georgiev, Canton, MI (US);
Raghav Khanna, Toledo, OH (US);
Michael Robert Hontz, Drexel Hill, PA (US);
Abstract
A hybrid edge termination structure and method of forming the same. The hybrid edge termination structure in accordance with the invention is based on a junction termination extension (JTE) architecture, but includes an additional Layer of guard ring (GR) structures to further implement the implantation of dopants into the structure. The hybrid edge termination structure of the invention has a three-Layer structure, with a top Layer and a bottom Layer each having a constant dopant concentration in the lateral direction, and a middle Layer consisting of a plurality of spatially defined alternating regions that exhibit the electrical properties of either the top or bottom layer. By including the second layer, a discretized varying charge profile can be obtained that approximates the varying charge profile obtained using tapered edge termination but with easier manufacturing and lower cost.