The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 07, 2025

Filed:

Aug. 09, 2022
Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

Ruilong Xie, Niskayuna, NY (US);

Nicholas Anthony Lanzillo, Wynantskill, NY (US);

Koichi Motoyama, Clifton Park, NY (US);

Brent A. Anderson, Jericho, VT (US);

Michael Rizzolo, Delmar, NY (US);

Lawrence A. Clevenger, Saratoga Springs, NY (US);

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H10B 61/00 (2023.01); H10D 30/00 (2025.01); H10N 50/01 (2023.01); H10N 50/10 (2023.01); H10N 50/80 (2023.01); H10N 59/00 (2023.01); H10B 63/00 (2023.01);
U.S. Cl.
CPC ...
H10B 61/22 (2023.02); H10D 30/501 (2025.01); H10N 50/01 (2023.02); H10N 50/80 (2023.02); H10N 59/00 (2023.02); H10B 63/30 (2023.02); H10N 50/10 (2023.02);
Abstract

A back side contact structure is provided that directly connects a first electrode of a MRAM, which is present in a back side of a wafer, to a source/drain structure of a transistor. The back side contact is self-aligned to the source/drain structure of the transistor as well as to the first electrode of the MRAM. The close proximity between the MRAM and the source/drain structure increases the speed of the device. MRAM yield is not compromised since no re-sputtering of back side contact metal onto the MRAM occurs.


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