The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 07, 2025

Filed:

Jan. 19, 2024
Applicant:

Taiwan Semiconductor Manufacturing Co., Ltd., Hsin-Chu, TW;

Inventors:

Ching-Wen Cheng, Zhubei, TW;

Xin-Kai Huang, Hsinchu, TW;

Kuei-Hsiung Cho, Xinpu Township, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/673 (2006.01); C23C 16/458 (2006.01); C23C 16/46 (2006.01); H01L 21/02 (2006.01);
U.S. Cl.
CPC ...
H01L 21/67309 (2013.01); C23C 16/4583 (2013.01); C23C 16/46 (2013.01); H01L 21/0217 (2013.01); H01L 21/02271 (2013.01);
Abstract

In an embodiment, a system includes: a base; and a rod set comprising multiple rods connected to the base, wherein each rod of the rod set comprises multiple fingers disposed in a vertically-stacked relationship to each other and separated respectively from each other by respective slots, wherein each slot is configured to receive a bevel of a wafer, and wherein each of the multiple fingers comprises a rounded end at a furthest extension.


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