The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 30, 2025

Filed:

Jan. 10, 2023
Applicant:

Changxin Memory Technologies, Inc., Hefei, CN;

Inventors:

Yong Lu, Hefei, CN;

Zhicheng Shi, Hefei, CN;

Xinran Liu, Hefei, CN;

Ruiqi Zhang, Hefei, CN;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/762 (2006.01); H01L 21/764 (2006.01); H01L 21/768 (2006.01); H10B 12/00 (2023.01); H10D 62/10 (2025.01); H10D 64/66 (2025.01);
U.S. Cl.
CPC ...
H10B 12/053 (2023.02); H01L 21/76289 (2013.01); H01L 21/764 (2013.01); H01L 21/7682 (2013.01); H10B 12/34 (2023.02); H10D 62/116 (2025.01); H10D 64/679 (2025.01); H01L 2221/1042 (2013.01); H01L 2221/1063 (2013.01);
Abstract

Embodiments provide a semiconductor structure and a fabricating method. The semiconductor structure includes: a substrate, where a trench is formed in the substrate; a conductive layer positioned in the trench, where the conductive layer includes a first conductive layer and a second conductive layer, the second conductive layer is positioned on the first conductive layer, and a projection area of a bottom of the second conductive layer within the trench is greater than a projection area of a top of the first conductive layer within the trench; a dielectric layer positioned between the conductive layer and an inner wall of the trench, where a top of the dielectric layer is lower than the top of the first conductive layer; an isolation layer positioned on the conductive layer; and a void defined by the isolation layer, the conductive layer, the dielectric layer, and a side wall of the trench.


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