The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 30, 2025

Filed:

Jun. 14, 2021
Applicant:

Tokyo Electron Limited, Tokyo, JP;

Inventors:

Takashi Sugimoto, Yamanashi, JP;

Hiroyuki Takahashi, Yamanashi, JP;

Shinya Okano, Yamanashi, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/67 (2006.01); H01L 21/324 (2006.01);
U.S. Cl.
CPC ...
H01L 21/67201 (2013.01); H01L 21/324 (2013.01); H01L 21/67115 (2013.01);
Abstract

A heating device for heating a substrate before the substrate is transferred to a processing device is provided. The heating device includes a support unit configured to support the substrate, and a heating unit including light emitting elements for emitting the light to individually heat divided regions of the substrate in plan view, the substrate being supported by the support unit. Among the light emitting elements, light outputs of light emitting elements that correspond to regions of the substrate in contact with a substrate holding portion of a transfer mechanism are higher than light outputs of light emitting elements that correspond to other regions of the substrate, the transfer mechanism being disposed outside the heating device to hold and transfer the substrate between the heating device and the processing device.


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