The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 23, 2025

Filed:

Jul. 05, 2023
Applicant:

United Microelectronics Corp., Hsin-Chu, TW;

Inventors:

Chang-Po Hsiung, Hsinchu, TW;

Ching-Chung Yang, Hsinchu, TW;

Shan-Shi Huang, Hsinchu, TW;

Wen-Fang Lee, Hsinchu, TW;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10D 84/82 (2025.01);
U.S. Cl.
CPC ...
H10D 84/82 (2025.01);
Abstract

A semiconductor structure comprises a substrate having a first well region of a first conductive type, a second well region of a second conductive type, and a junction between the first well region and the second well region. The first conductive type and the second conductive type are complementary. A plurality of first dummy structures and second dummy structures and at least a first active region are defined in the first well region by an isolation structure. The first dummy structures are adjacent to the junction and respectively comprise a first metal silicide region and a first doped region of the first conductive type and between the first metal silicide region and the first well region. The first dummy structures are between the second dummy structures and the junction. The second dummy structures respectively comprise a second metal silicide region that direct contacts the first well region.


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