The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 23, 2025

Filed:

Jun. 13, 2022
Applicant:

Infineon Technologies Ag, Neubiberg, DE;

Inventors:

Joachim Weyers, Hoehenkirchen, DE;

Anton Mauder, Kolbermoor, DE;

Ralf Siemieniec, Villach, AT;

Guang Zeng, Haar, DE;

Assignee:

Infineon Technologies AG, Neubiberg, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10D 84/00 (2025.01); H10D 30/66 (2025.01); H10D 62/10 (2025.01); H10D 62/832 (2025.01);
U.S. Cl.
CPC ...
H10D 84/144 (2025.01); H10D 30/668 (2025.01); H10D 62/127 (2025.01); H10D 62/8325 (2025.01);
Abstract

A semiconductor device includes a transistor cell with a source region of a first conductivity type and a gate electrode. The source region is formed in a wide bandgap semiconductor portion. A diode chain includes a plurality of diode structures. The diode structures are formed in the wide bandgap semiconductor portion and electrically connected in series. Each diode structure includes a cathode region of the first conductivity type and an anode region of a complementary second conductivity type. A gate metallization is electrically connected with the gate electrode and with a first one of the anode regions in the diode chain. A source electrode structure is electrically connected with the source region and with a last one of the cathode regions in the diode chain.


Find Patent Forward Citations

Loading…