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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12424449 B1

PDFFull Text
Date of Patent:
Sep. 23, 2025

Filed:

Apr. 10, 2024

Cmp system and method of use

Applicant:

Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;

Inventors:

Te-Chien Hou, Kaohsiung, TW;

Yu-Ting Yen, Kaohsiung, TW;

Cheng-Yu Kuo, Zhudong Township, TW;

Chih Hung Chen, Hsinchu, TW;

William Weilun Hong, Hsinchu, TW;

Kei-Wei Chen, Tainan, TW;

Assignee:

Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;

Attorney:

Slater Matsil, LLP

Primary Examiner:

Parviz Hassanzadeh

Assistant Examiner:

Margaret Klunk

Int. Cl.
CPC ...
H01L 21/3105 (2006.01); B24B 37/04 (2012.01); B24B 37/20 (2012.01); H01L 21/02 (2006.01); H01L 21/67 (2006.01); H10D 64/01 (2025.01); B24B 7/04 (2006.01); B24B 29/00 (2006.01); C02F 1/469 (2023.01);
U.S. Cl.
CPC ...
H01L 21/31053 (2013.01); B24B 37/042 (2013.01); B24B 37/044 (2013.01); B24B 37/20 (2013.01); H01L 21/02065 (2013.01); H01L 21/31055 (2013.01); H01L 21/67046 (2013.01); H01L 21/67092 (2013.01); H10D 64/017 (2025.01); B24B 7/04 (2013.01); B24B 29/00 (2013.01); C02F 1/4691 (2013.01);
Abstract

A chemical mechanical planarization (CMP) system including a capacitive deionization module (CDM) for removing ions from a solution and a method for using the same are disclosed. In an embodiment, an apparatus includes a planarization unit for planarizing a wafer; a cleaning unit for cleaning the wafer; a wafer transportation unit for transporting the wafer between the planarization unit and the cleaning unit; and a capacitive deionization module for removing ions from a solution used in at least one of the planarization unit or the cleaning unit.

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