The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 16, 2025
Filed:
May. 23, 2022
Denso Corporation, Kariya, JP;
Kazufumi Aoki, Kariya, JP;
Naoki Maruno, Kariya, JP;
Bahman Soltani, Kariya, JP;
Yuya Kato, Kariya, JP;
Kyohei Kotake, Kariya, JP;
Shinji Mukota, Kariya, JP;
Manabu Tomisaka, Kariya, JP;
Yasuo Ishihara, Kariya, JP;
Shusaku Nakazawa, Kariya, JP;
Tetsuji Yamaguchi, Kariya, JP;
DENSO CORPORATION, Kariya, JP;
Abstract
Provided is a surface processing apparatus and a surface processing method for a SiC substrate using anodization. The surface processing apparatus for the SiC substrate includes a surface processing pad and a power supply device. The surface processing pad includes a grinding wheel layer. The grinding wheel layer is disposed facing a workpiece surface of the SiC substrate. The power supply device passes a pulsed current having a period greater than 0.01 seconds and less than or equal to 20 seconds for anodizing the workpiece surface to be processed by the grinding wheel layer through the SiC substrate as an anode in the presence of an electrolyte.