The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 16, 2025

Filed:

Oct. 28, 2021
Applicant:

Ebara Corporation, Tokyo, JP;

Inventors:

Masaki Tomita, Tokyo, JP;

Yasuyuki Masuda, Tokyo, JP;

Assignee:

EBARA CORPORATION, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C25D 17/00 (2006.01); C25D 17/06 (2006.01); C25D 21/04 (2006.01); C25D 21/12 (2006.01);
U.S. Cl.
CPC ...
C25D 17/002 (2013.01); C25D 17/001 (2013.01); C25D 17/06 (2013.01); C25D 21/04 (2013.01); C25D 21/12 (2013.01);
Abstract

Provided is a technique that can suppress deterioration of plating quality of a substrate due to gas bubbles that remain entirely on a lower surface of a membrane. A plating apparatusincludes a plating tank, a substrate holder, and a membrane module. The membrane module includes a first membraneand a second membrane. The second membrane has an inflow portfor causing a plating solution in a first region Rbelow the second membrane to flow into a second region Rabove the second membrane and below the first membrane, and an inclined portioninclining relative to a horizontal direction and inclining so as to be positioned upward as heading from a center side of an anode chamber to an outer edge side of the anode chamber.


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