The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 09, 2025

Filed:

Apr. 14, 2021
Applicant:

Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;

Inventors:

Huanlong Liu, San Jose, CA (US);

Jian Zhu, San Jose, CA (US);

Keyu Pi, San Jose, CA (US);

Ru-Ying Tong, Los Gatos, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01R 33/09 (2006.01); G11C 11/16 (2006.01); H01F 41/30 (2006.01); H10N 50/01 (2023.01); H10N 50/10 (2023.01); G11B 5/39 (2006.01);
U.S. Cl.
CPC ...
H10N 50/01 (2023.02); G01R 33/096 (2013.01); G01R 33/098 (2013.01); G11C 11/161 (2013.01); H01F 41/307 (2013.01); H10N 50/10 (2023.02); G11B 5/3909 (2013.01); G11B 2005/3996 (2013.01);
Abstract

A method of forming a MTJ with a tunnel barrier having a high tunneling magnetoresistance ratio, and low resistance x area value is disclosed. The method preserves perpendicular magnetic anisotropy in bottom and top magnetic layers that adjoin bottom and top surfaces of the tunnel barrier. A key feature is a passive oxidation step of a first Mg layer that is deposited on the bottom magnetic layer wherein a maximum oxygen pressure is 10-5 torr. A bottom portion of the first Mg layer remains unoxidized thereby protecting the bottom magnetic layer from substantial oxidation during subsequent oxidation and anneal processes that are employed to complete the fabrication of the tunnel barrier and MTJ. An uppermost Mg layer may be formed as the top layer in the tunnel barrier stack before a top magnetic layer is deposited.


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