The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 09, 2025

Filed:

Jan. 18, 2023
Applicant:

The Board of Trustees of the University of Illinois, Urbana, IL (US);

Inventors:

Can Bayram, Champaign, IL (US);

Muhammad Ali Johar, Urbana, IL (US);

Jae Kwon Lee, Champaign, IL (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10H 20/81 (2025.01); C30B 25/16 (2006.01); C30B 25/18 (2006.01); C30B 29/40 (2006.01); H01L 21/02 (2006.01); H01L 21/311 (2006.01); H01L 21/3213 (2006.01); H10H 20/01 (2025.01); H10H 20/82 (2025.01); H01S 5/026 (2006.01); H01S 5/343 (2006.01); H10H 20/817 (2025.01); H10H 20/824 (2025.01); H10H 20/825 (2025.01);
U.S. Cl.
CPC ...
H01L 21/31111 (2013.01); C30B 25/16 (2013.01); C30B 25/183 (2013.01); C30B 29/406 (2013.01); H01L 21/0245 (2013.01); H01L 21/02458 (2013.01); H01L 21/02488 (2013.01); H01L 21/02505 (2013.01); H01L 21/0254 (2013.01); H01L 21/02595 (2013.01); H01L 21/02609 (2013.01); H01L 21/0262 (2013.01); H01L 21/32134 (2013.01); H10H 20/01335 (2025.01); H01L 21/02381 (2013.01); H01S 5/026 (2013.01); H01S 5/34333 (2013.01); H01S 2304/04 (2013.01); H10H 20/817 (2025.01); H10H 20/824 (2025.01); H10H 20/825 (2025.01);
Abstract

A wafer includes a buried substrate; a first layer of silicon (100) disposed on the buried substrate that includes silicon sidewalls (111) at an angle to the buried substrate and that form a bottom of each of multiple U-shaped grooves; a second layer of patterned oxide disposed on the silicon (100) that provides vertical sidewalls of each U-shaped groove formed within the first and second layers; a third layer of a buffer covering the first layer and partially covering the second layer partway up the vertical sidewalls; and multiple gallium nitride (GaN)-based structures disposed within the multiple U-shaped grooves, the multiple GaN-based structures each including cubic gallium nitride (c-GaN) formed at merged growth fronts of hexagonal gallium nitride (h-GaN) that extend from the silicon sidewalls (111).


Find Patent Forward Citations

Loading…