The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 09, 2025

Filed:

May. 15, 2020
Applicants:

The Board of Trustees of the Leland Stanford Junior University, Stanford, CA (US);

The Regents of the University of California, Oakland, CA (US);

Inventors:

Srabanti Chowdhury, San Ramon, CA (US);

Dong Ji, San Jose, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/265 (2006.01); H01L 21/02 (2006.01); H01L 21/266 (2006.01); H01L 21/324 (2006.01); H10D 62/85 (2025.01);
U.S. Cl.
CPC ...
H01L 21/26546 (2013.01); H01L 21/0254 (2013.01); H01L 21/266 (2013.01); H01L 21/3245 (2013.01); H10D 62/8503 (2025.01);
Abstract

In certain examples, methods and semiconductor structures are directed to use of a doped buried region (e.g., Mg-dopant) including a III-Nitride material and having a diffusion path ('ion diffusion path') that includes hydrogen introduced by using ion implantation via at least one ion species. An ion implantation thermal treatment causes hydrogen to diffuse through the ion implanted path and causes activation of the buried region. In more specific examples in which such semiconductor structures have an ohmic contact region at which a source of a transistor interfaces with the buried region, the ohmic contact region is without etching-based damage due at least in part to the post-ion implantation thermal treatment.


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