The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 09, 2025

Filed:

Sep. 28, 2018
Applicant:

Lam Research Corporation, Fremont, CA (US);

Inventors:

Leonid Belau, Pleasanton, CA (US);

Alexei Marakhtanov, Albany, CA (US);

Eric Hudson, Berkeley, CA (US);

John Patrick Holland, San Jose, CA (US);

Assignee:

Lam Research Corporation, Fremont, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01J 37/32 (2006.01); C23C 16/455 (2006.01); H01L 21/02 (2006.01); H01L 21/306 (2006.01); H01L 21/311 (2006.01); H01L 21/67 (2006.01); H01L 21/687 (2006.01);
U.S. Cl.
CPC ...
H01J 37/32844 (2013.01); C23C 16/45521 (2013.01); H01J 37/32091 (2013.01); H01J 37/32183 (2013.01); H01J 37/32449 (2013.01); H01J 37/32522 (2013.01); H01J 37/32642 (2013.01); H01J 37/32724 (2013.01); H01J 37/32862 (2013.01); H01L 21/02019 (2013.01); H01L 21/02021 (2013.01); H01L 21/02057 (2013.01); H01L 21/30621 (2013.01); H01L 21/311 (2013.01); H01L 21/31105 (2013.01); H01L 21/31116 (2013.01); H01L 21/67253 (2013.01); H01L 21/68735 (2013.01); H01J 2237/3341 (2013.01);
Abstract

A wafer is supported on a wafer support structure such that a lower peripheral open region exists between a peripheral portion of a bottom surface of the wafer and an edge ring structure. The edge ring structure is configured to circumscribe both the wafer support structure and the wafer. A plasma is generated above a top surface of the wafer. The plasma causes accumulation of byproduct material within the lower peripheral open region. A byproduct volatizing gas is supplied to the lower peripheral open region to control the accumulation of the byproduct material within the lower peripheral open region during generation of the plasma. Use of the byproduct volatizing gas to control the accumulation of the byproduct material within the lower peripheral open region serves to prevent electrical arcing and particle contamination.


Find Patent Forward Citations

Loading…