The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 02, 2025
Filed:
May. 26, 2022
Applicant:
Taiwan Semiconductor Manufacturing Company Ltd., Hsinchu, TW;
Inventors:
Wei-Kang Liu, Taichung, TW;
Chih-Tsung Shih, Hsinchu, TW;
Hau-Yan Lu, Hsinchu, TW;
Yingkit Felix Tsui, Cupertino, CA (US);
Assignee:
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD., Hsinchu, TW;
Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H10F 77/40 (2025.01); G02B 6/42 (2006.01); H10F 71/00 (2025.01); H10F 77/00 (2025.01);
U.S. Cl.
CPC ...
H10F 77/413 (2025.01); G02B 6/4214 (2013.01); H10F 71/00 (2025.01); H10F 77/953 (2025.01);
Abstract
A method for manufacturing an integrated circuit device is provided. The method includes: providing a photonic structure including an insulating structure and an optical coupler embedded in the insulating structure; and removing a portion of the insulating structure to expose a coupling surface of the optical coupler and form a light reflective structure corresponding to the coupling surface.