The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 02, 2025

Filed:

Oct. 24, 2019
Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

Jingyun Zhang, Albany, NY (US);

Takashi Ando, Tuckahoe, NY (US);

Choonghyun Lee, Rensselaer, NY (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/12 (2006.01); H10D 30/67 (2025.01); H10D 64/27 (2025.01); H10D 84/01 (2025.01); H10D 84/03 (2025.01); H10D 86/00 (2025.01);
U.S. Cl.
CPC ...
H10D 86/215 (2025.01); H10D 30/6735 (2025.01); H10D 64/516 (2025.01); H10D 84/0144 (2025.01); H10D 84/038 (2025.01); H10D 30/6736 (2025.01);
Abstract

A semiconductor device includes a first gate-all-around field-effect transistor (GAA FET) device including a first gate stack having first channels and dielectric material including first and second portions having respective thicknesses formed around the first interfacial layers. The semiconductor device further includes a second GAA FET device including a second gate stack having second channels and the dielectric material formed around the second interfacial layers. A threshold voltage (Vt) shift associated with the semiconductor device is achieved based on a thickness of the first portion of the dielectric material.


Find Patent Forward Citations

Loading…