The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 02, 2025
Filed:
Jan. 13, 2020
Applicant:
Taiwan Semiconductor Manufacturing Company, Ltd., Hsin-Chu, TW;
Inventors:
Assignee:
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD., Hsin-Chu, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/778 (2006.01); H01L 21/033 (2006.01); H01L 21/768 (2006.01); H01L 23/528 (2006.01); H01L 29/45 (2006.01); H01L 29/66 (2006.01); H10D 84/01 (2025.01); H10D 84/03 (2025.01); H01L 23/485 (2006.01); H01L 23/532 (2006.01);
U.S. Cl.
CPC ...
H01L 21/76816 (2013.01); H01L 21/0332 (2013.01); H01L 21/76895 (2013.01); H01L 23/5283 (2013.01); H10D 84/0149 (2025.01); H10D 84/0186 (2025.01); H10D 84/038 (2025.01); H01L 23/485 (2013.01); H01L 23/53233 (2013.01); H01L 23/53238 (2013.01); H01L 2924/0002 (2013.01);
Abstract
A semiconductor device is disclosed, including a plurality of conductive features disposed over a substrate. A dielectric layer separates the conductive features. A conductive line is provided, connecting a subset of the conductive features. The conductive line includes a line-like portion and a line-end portion.
Ting, Chih-Yuan. (2025). Integrated circuit with conductive line having line-ends (U.S. Patent No. 12406878). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12406878
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile