The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 02, 2025

Filed:

Feb. 18, 2021
Applicant:

Tokyo Electron Limited, Tokyo, JP;

Inventors:

Yuichiro Inatomi, Kumamoto, JP;

Yusaku Hashimoto, Koshi, JP;

Takafumi Niwa, Kumamoto, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C23C 18/16 (2006.01); B05B 13/02 (2006.01); B05C 11/10 (2006.01);
U.S. Cl.
CPC ...
C23C 18/163 (2013.01); B05B 13/02 (2013.01); B05C 11/1015 (2013.01); C23C 18/1676 (2013.01);
Abstract

A substrate processing apparatusincludes a holder(A), a supplyand a cover body. The holder(A) is configured to attract and hold a substrate W. The supplyis configured to supply a heated plating liquid to the substrate W attracted to and held by the holder(A). The cover bodyis configured to cover the substrate W attracted to and held by the holder(A), and heat the plating liquid on the substrate W by using a heating deviceprovided in a ceiling memberthereof facing a top surface of the substrate W. The holder(A) includes protrusionsprojecting from a facing surfacethereof facing a bottom surface of the substrate W toward the bottom surface of the substrate W, and each protrusion has a protruding height equal to or larger than 1 mm.


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