The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 26, 2025

Filed:

Dec. 30, 2021
Applicant:

Carl Zeiss Smt Gmbh, Oberkochen, DE;

Inventor:

Dieter Bader, Goeggingen, DE;

Assignee:

CARL ZEISS SMT GMBH, Oberkochen, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C 65/48 (2006.01); B29C 65/00 (2006.01); B29L 11/00 (2006.01); G02B 27/62 (2006.01); G03F 7/00 (2006.01);
U.S. Cl.
CPC ...
B29C 65/48 (2013.01); B29C 66/95 (2013.01); G02B 27/62 (2013.01); B29L 2011/0016 (2013.01); B29L 2011/0058 (2013.01); G03F 7/70266 (2013.01);
Abstract

Method and device for producing an adhesive bond between a first component and a second component (optical element) for microlithography. The method involves: introducing the first and second components into a positioning device for changing the relative position between the first and second components, calibrating a first relative position, in which a distance between the first and second components has a first value defining a predefined adhesive gap, calibrating a second relative position, in which a distance between the first and second components has a second value greater than the first value, applying adhesive to the first component while the first and second components are at a distance greater than the first value, and setting the first relative position while forming the adhesive bond between the first and second components. Calibrating the first and second relative positions are carried out before the adhesive is applied to the first component.


Find Patent Forward Citations

Loading…