The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 19, 2025
Filed:
Jul. 14, 2022
United Microelectronics Corp., Hsinchu, TW;
Chia-Chen Sun, Kaohsiung, TW;
En-Chiuan Liou, Tainan, TW;
United Microelectronics Corp., Hsinchu, TW;
Abstract
Provided is a semiconductor structure including a first and a second conductive layers, and a first group of vias. The second conductive layer is disposed on the first conductive layer. The first group of vias is disposed between and connects the first and the second conductive layer. The first group of vias includes a first, a second, a third and a fourth vias. The first and second vias are arranged in a first column. The third and fourth vias are arranged in a second column. The first via is adjacent to the third via. The second via is adjacent to the fourth via. The extension directions of the first and second vias are orthogonal to each other, the extension directions of the third and the fourth vias are orthogonal to each other, and the extending directions of the first and the third vias are orthogonal to each other.