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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12394711 B1

PDFFull Text
Date of Patent:
Aug. 19, 2025

Filed:

Mar. 30, 2022

Microelectronic devices with staircased stadiums and both through-step and to-step contacts, and related systems and methods

Applicant:

Micron Technology, Inc., Boise, ID (US);

Inventors:

Harsh Narendrakumar Jain, Boise, ID (US);

Scott L. Light, Boise, ID (US);

Shruthi Kumara Vadivel, Boise, ID (US);

Shuangqiang Luo, Boise, ID (US);

Assignee:

Micron Technology, Inc., Boise, ID (US);

Attorney:

TraskBritt

Primary Examiner:

Ida M Soward

Int. Cl.
CPC ...
H01L 23/52 (2006.01); H01L 21/768 (2006.01); H01L 23/528 (2006.01); H10B 43/27 (2023.01); H10B 20/00 (2023.01); H10B 41/20 (2023.01); H10B 43/20 (2023.01); H10B 51/20 (2023.01); H10B 53/20 (2023.01); H10D 88/00 (2025.01);
U.S. Cl.
CPC ...
H01L 23/528 (2013.01); H01L 21/76895 (2013.01); H10B 43/27 (2023.02); H10B 20/50 (2023.02); H10B 41/20 (2023.02); H10B 43/20 (2023.02); H10B 51/20 (2023.02); H10B 53/20 (2023.02); H10D 88/00 (2025.01);
Abstract

Microelectronic devices include a tiered stack including a vertically alternating sequence of insulative structures and conductive structures arranged in tiers. A stadium within the tiered stack includes a staircase with steps at ends of some of the tiers. The steps each have a tread provided by an upper surface portion of one of the conductive structures. Conductive contact structures extend to one of the steps and include a first conductive contact structure terminating at the tread of the step and a second conductive contact structure extending through the tread of the step. Related fabrication methods and electronic systems are also disclosed.

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