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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12394696 B1

PDFFull Text
Date of Patent:
Aug. 19, 2025

Filed:

May. 05, 2022

Package structure including an array of copper pillars and methods of forming the same

Applicant:

Taiwan Semiconductor Manufacturing Company Limited, Hsinchu, TW;

Inventors:

Wei-Yu Chen, Hsinchu, TW;

Collin Jordon Fleshman, Hsinchu, TW;

Chien-Hsun Lee, Chu-tung Town, TW;

Assignee:

Taiwan Semiconductor Manufacturing Company Limited, Hsinchu, TW;

Attorney:

The Marbury Law Group, PLLC

Primary Examiner:

Nicholas J Tobergte

Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 21/48 (2006.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01); H01L 23/498 (2006.01); H01L 23/538 (2006.01); H01L 25/18 (2023.01);
U.S. Cl.
CPC ...
H01L 23/49811 (2013.01); H01L 21/4853 (2013.01); H01L 23/3107 (2013.01); H01L 23/49833 (2013.01); H01L 23/49838 (2013.01); H01L 23/5385 (2013.01); H01L 24/16 (2013.01); H01L 24/96 (2013.01); H01L 25/18 (2013.01); H01L 2224/16225 (2013.01);
Abstract

An in-process structure including an interposer is provided. The interposer includes first interposer bonding pads. An array of copper pillar structures is bonded to the first interposer bonding pads using interposer-side solder material portions. A packaging substrate is attached to the array of copper pillar structures by bonding the array of copper pillar structures to substrate bonding pads located on the packaging substrate using substrate-side solder material portions.

Find Patent Forward Citations

Chen, Wei-Yu. (2025). Package structure including an array of copper pillars and methods of forming the same (U.S. Patent No. 12394696). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12394696

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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