The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 12, 2025
Filed:
Dec. 22, 2020
Applicant:
Intel Corporation, Santa Clara, CA (US);
Inventors:
Xiaoqian Li, Chandler, AZ (US);
Nitin Deshpande, Chandler, AZ (US);
Omkar Karhade, Chandler, AZ (US);
Assignee:
Intel Corporation, Santa Clara, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G02B 6/42 (2006.01); G02B 6/30 (2006.01); G02B 6/34 (2006.01);
U.S. Cl.
CPC ...
G02B 6/423 (2013.01); G02B 6/30 (2013.01); G02B 6/4204 (2013.01); G02B 6/4206 (2013.01); G02B 6/4214 (2013.01); G02B 6/4239 (2013.01); G02B 6/4244 (2013.01); G02B 6/34 (2013.01);
Abstract
Embodiments described herein may be related to apparatuses, processes, and techniques for coupling a micro-lens array to a photonics die. In embodiments, this coupling may be performed as an attach at a wafer level. In embodiments, wafer level optical testing of the photonics die with the attached micro-lens array may be tested electrically and optically before the photonics die is assembled into a package, in various configurations. Other embodiments may be described and/or claimed.