The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 05, 2025
Filed:
Jun. 08, 2022
Nxp Usa, Inc., Austin, TX (US);
Michael B. Vincent, Chandler, AZ (US);
Scott M. Hayes, Chandler, AZ (US);
NXP USA, INC., Austin, TX (US);
Abstract
A method of forming a semiconductor device is provided. The method includes placing a semiconductor die and an RF sub-assembly on a carrier substrate. The RF sub-assembly includes a sacrificial blank, a conductive radiant element, and a conductive shield. At least a portion of the semiconductor die and the RF sub-assembly is encapsulated with an encapsulant. The carrier substrate is separated from the encapsulated semiconductor die and RF sub-assembly to expose a side of the sacrificial blank. The sacrificial blank is removed to form a cavity in the RF sub-assembly such that the conductive radiant element and the conductive shield are exposed through the cavity. A package lid is affixed on the encapsulated semiconductor die and RF sub-assembly and configured to serve as a signal reflector for propagation of an RF signal.