The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 29, 2025

Filed:

May. 27, 2022
Applicant:

Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;

Inventors:

Wang-Chun Huang, Kaohsiung, TW;

Hou-Yu Chen, Hsinchu County, TW;

Jin Cai, Hsinchu, TW;

Chih-Hao Wang, Hsinchu County, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/28 (2025.01); H10D 30/01 (2025.01); H10D 64/23 (2025.01);
U.S. Cl.
CPC ...
H10D 30/024 (2025.01); H10D 64/251 (2025.01);
Abstract

A semiconductor device includes semiconductor nanosheets, a gate structure, and a dielectric spacer. The semiconductor nanosheets are vertically stacked over each other, disposed above a semiconductor substrate, and serve as channel regions. A bottommost semiconductor nanosheet most proximate from the semiconductor substrate is a thinnest nanosheet of the semiconductor nanosheets. The gate structure surrounds each of the semiconductor nanosheets in a first cross-section, and the dielectric spacer is interposed between the bottommost semiconductor nanosheet and the semiconductor substrate and adjoins the gate structure in the first cross-section.


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