The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 29, 2025

Filed:

Mar. 24, 2022
Applicant:

Wolfspeed, Inc., Durham, NC (US);

Inventors:

Woongsun Kim, Cary, NC (US);

Daniel Jenner Lichtenwalner, Raleigh, NC (US);

Naeem Islam, Morrisville, NC (US);

Madankumar Sampath, Morrisville, NC (US);

Sei-Hyung Ryu, Cary, NC (US);

Assignee:

WOLFSPEED, INC., Durham, NC (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/78 (2006.01); H10D 12/00 (2025.01); H10D 12/01 (2025.01); H10D 62/10 (2025.01); H10D 64/27 (2025.01);
U.S. Cl.
CPC ...
H10D 12/481 (2025.01); H10D 12/032 (2025.01); H10D 62/127 (2025.01); H10D 64/513 (2025.01);
Abstract

A power semiconductor device includes a semiconductor layer structure comprising a drift region of a first conductivity type, and a gate trench extending into the drift region. The gate trench includes sidewalls and a bottom surface therebetween. A bottom shielding structure of a second conductivity type is provided under the bottom surface of the gate trench. First and second support shielding structures of the second conductivity type extend into the drift region on opposing sides of the gate trench and are spaced apart from the sidewalls thereof. A material composition, distance of extension into the drift region relative to a surface of the semiconductor layer structure, and/or dopant concentration of the bottom shielding structure may be different from that of the first and second support shielding structures. Related devices and fabrication methods are also discussed.


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