The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 29, 2025
Filed:
Aug. 25, 2022
Applicant:
Kla Corporation, Milpitas, CA (US);
Inventors:
Assignee:
KLA Corporation, Milpitas, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06T 7/13 (2017.01); G01N 23/2251 (2018.01); G06T 7/00 (2017.01); G06T 7/11 (2017.01); G06T 7/70 (2017.01);
U.S. Cl.
CPC ...
G01N 23/2251 (2013.01); G06T 7/0006 (2013.01); G06T 7/11 (2017.01); G06T 7/13 (2017.01); G06T 7/70 (2017.01); G01N 2223/07 (2013.01); G01N 2223/418 (2013.01); G01N 2223/507 (2013.01); G01N 2223/6116 (2013.01); G06T 2207/10061 (2013.01); G06T 2207/20132 (2013.01); G06T 2207/30148 (2013.01);
Abstract
Parameters from an inspection image representing mechanical vibrations and electromagnetic interference can be determined. An X-direction vibration spectrum can be determined based on the X-direction offsets. A Y-direction vibration spectrum can be determined based on the Y-direction offsets. The determinations can be based on a swath image of a workpiece, such as a semiconductor wafer or reticle.