The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 29, 2025
Filed:
Oct. 26, 2022
Applicant:
Tokyo Electron Limited, Tokyo, JP;
Inventors:
Tetsuya Sakazaki, Kumamoto, JP;
Hitoshi Kosugi, Kumamoto, JP;
Assignee:
TOKYO ELECTRON LIMITED, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C23F 1/00 (2006.01); C23F 1/44 (2006.01); H01L 21/306 (2006.01); H01L 21/311 (2006.01); H01L 21/3213 (2006.01); H01L 21/67 (2006.01);
U.S. Cl.
CPC ...
C23F 1/00 (2013.01); C23F 1/44 (2013.01); H01L 21/30604 (2013.01); H01L 21/311 (2013.01); H01L 21/31111 (2013.01); H01L 21/32134 (2013.01); H01L 21/67028 (2013.01); H01L 21/67051 (2013.01); H01L 21/67075 (2013.01); H01L 21/6708 (2013.01);
Abstract
A substrate processing method includes: supplying a first processing liquid containing a chelating agent and a solvent from a first tank toward a substrate having a film of a metal formed on a surface thereof to generate a complex containing the metal and the chelating agent while rotating the substrate; and supplying a second processing liquid containing water toward the substrate to dissolve the complex in the second processing liquid while rotating the substrate, after the complex is generated.