The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 22, 2025

Filed:

Oct. 13, 2023
Applicant:

Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;

Inventors:

Han-Pin Chung, Kaohsiung, TW;

Chih-Tang Peng, Zhubei, TW;

Tien-I Bao, Taoyuan, TW;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H10D 84/03 (2025.01); H01L 21/02 (2006.01); H01L 21/762 (2006.01); H10D 30/62 (2025.01); H10D 30/69 (2025.01); H10D 64/01 (2025.01); H10D 84/01 (2025.01); H10D 84/85 (2025.01); H10D 86/01 (2025.01);
U.S. Cl.
CPC ...
H10D 84/038 (2025.01); H01L 21/0223 (2013.01); H01L 21/02252 (2013.01); H01L 21/02255 (2013.01); H01L 21/02271 (2013.01); H01L 21/76229 (2013.01); H10D 30/795 (2025.01); H10D 64/017 (2025.01); H10D 84/0151 (2025.01); H10D 84/0158 (2025.01); H10D 84/0188 (2025.01); H10D 84/0193 (2025.01); H10D 84/853 (2025.01); H01L 21/02323 (2013.01); H01L 21/02337 (2013.01); H01L 21/0234 (2013.01); H01L 21/02348 (2013.01); H10D 30/6219 (2025.01); H10D 30/792 (2025.01); H10D 86/011 (2025.01);
Abstract

A semiconductor structure and a method for forming the same are provided. The method includes forming a first protruding structure and a second protruding structure over a substrate, and forming a first insulation material layer on the first protruding structure and the second protruding structure. The method includes performing a pre-treatment process on the first insulation material layer to form a first treated insulation material layer, and forming a second insulation material layer on the first treated insulation material layer. The method includes performing a first insulation material conversion process on the first treated insulation material layer and the second insulation material layer. The first protruding structure and the second protruding structure are bent toward opposite directions during the first insulation material conversion process.


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