The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 22, 2025

Filed:

Jul. 26, 2022
Applicant:

Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;

Inventors:

Ding-Kang Shih, New Taipei, TW;

Pang-Yen Tsai, Hsin-Chu Hsian, TW;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H10D 84/01 (2025.01); C30B 25/02 (2006.01); C30B 29/08 (2006.01); C30B 29/52 (2006.01); C30B 33/12 (2006.01); H01L 21/02 (2006.01); H01L 21/285 (2006.01); H01L 21/3065 (2006.01); H01L 21/768 (2006.01); H01L 23/535 (2006.01); H10D 62/13 (2025.01); H10D 62/80 (2025.01); H10D 62/832 (2025.01); H10D 64/62 (2025.01); H10D 84/03 (2025.01); H10D 84/85 (2025.01);
U.S. Cl.
CPC ...
H10D 84/0186 (2025.01); C30B 25/02 (2013.01); C30B 29/08 (2013.01); C30B 29/52 (2013.01); C30B 33/12 (2013.01); H01L 21/02521 (2013.01); H01L 21/02532 (2013.01); H01L 21/28518 (2013.01); H01L 21/3065 (2013.01); H01L 21/76805 (2013.01); H01L 21/76886 (2013.01); H01L 21/76895 (2013.01); H01L 23/535 (2013.01); H10D 62/151 (2025.01); H10D 62/80 (2025.01); H10D 62/832 (2025.01); H10D 64/62 (2025.01); H10D 84/017 (2025.01); H10D 84/0193 (2025.01); H10D 84/038 (2025.01); H10D 84/853 (2025.01);
Abstract

A method includes providing a p-type S/D epitaxial feature and an n-type source/drain (S/D) epitaxial feature, forming a semiconductor material layer over the n-type S/D epitaxial feature and the p-type S/D epitaxial feature, processing the semiconductor material layer with a germanium-containing gas, where the processing of the semiconductor material layer forms a germanium-containing layer over the semiconductor material layer, etching the germanium-containing layer, where the etching of the germanium-containing layer removes the germanium-containing layer formed over the n-type S/D epitaxial feature and the semiconductor material layer formed over the p-type S/D epitaxial feature, and forming a first S/D contact over the semiconductor material layer remaining over the n-type S/D epitaxial feature and a second S/D contact over the p-type S/D epitaxial feature. The semiconductor material layer may have a composition similar to that of the n-type S/D epitaxial feature.


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