The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 22, 2025
Filed:
Mar. 24, 2022
Applicant:
Samsung Electronics Co., Ltd., Suwon-si, KR;
Inventors:
Keunwook Shin, Yongin-si, KR;
Kyung-Eun Byun, Seongnam-si, KR;
Sangsoo Lee, Seongnam-si, KR;
Changhyun Kim, Seoul, KR;
Changseok Lee, Gwacheon-si, KR;
Assignee:
Samsung Electronics Co., Ltd., Gyeonggi-do, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10D 30/00 (2025.01); H10B 43/27 (2023.01); H10B 51/20 (2023.01); H10D 30/67 (2025.01); H10D 62/80 (2025.01);
U.S. Cl.
CPC ...
H10D 30/6757 (2025.01); H10B 43/27 (2023.02); H10B 51/20 (2023.02); H10D 62/882 (2025.01);
Abstract
Provided is a thin film structure including a substrate, a metal layer on the substrate and spaced apart from the substrate, and a two-dimensional material layer between the substrate and the metal layer. The two-dimensional material layer may be configured to limit and/or block an electron transfer between the substrate and the metal layer. A resistivity of a metal layer on the two-dimensional material layer may be lowered by the two-dimensional material layer.