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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12368087 B1

PDFFull Text
Date of Patent:
Jul. 22, 2025

Filed:

Aug. 01, 2024

Embedded cooling systems for advanced device packaging and methods of manufacturing the same

Applicant:

Adeia Semiconductor Bonding Technologies Inc., San Jose, CA (US);

Inventors:

Belgacem Haba, Saratoga, CA (US);

Rajesh Katkar, Milpitas, CA (US);

Ron Zhang, Sunnyvale, CA (US);

Thomas Workman, San Jose, CA (US);

Gaius Gillman Fountain, Jr., Youngsville, NC (US);

Assignee:

Adeia Semiconductor Bonding Technologies Inc., San Jose, CA (US);

Attorney:

Haley Guiliano LLP

Primary Examiner:

Niki H Nguyen

Int. Cl.
CPC ...
H01L 23/34 (2006.01); H01L 21/48 (2006.01); H01L 23/00 (2006.01); H01L 23/10 (2006.01); H01L 23/31 (2006.01); H01L 23/427 (2006.01); H01L 23/473 (2006.01); H01L 25/18 (2023.01); H05K 1/02 (2006.01); H10B 80/00 (2023.01);
U.S. Cl.
CPC ...
H01L 23/473 (2013.01); H01L 21/4807 (2013.01); H01L 21/4882 (2013.01); H01L 23/10 (2013.01); H01L 23/3135 (2013.01); H01L 23/427 (2013.01); H01L 24/05 (2013.01); H01L 24/08 (2013.01); H01L 24/80 (2013.01); H01L 24/16 (2013.01); H01L 24/32 (2013.01); H01L 24/73 (2013.01); H01L 25/18 (2013.01); H01L 2224/05541 (2013.01); H01L 2224/05551 (2013.01); H01L 2224/05687 (2013.01); H01L 2224/08225 (2013.01); H01L 2224/08245 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/80895 (2013.01); H01L 2224/80896 (2013.01); H01L 2924/3511 (2013.01); H01L 2924/35121 (2013.01); H05K 1/0203 (2013.01); H05K 2201/10325 (2013.01); H05K 2201/10409 (2013.01); H05K 2201/10704 (2013.01); H10B 80/00 (2023.02);
Abstract

A device package comprising an integrated cooling assembly comprising a semiconductor device and a cold plate directly bonded to the semiconductor device. The cold plate comprises a top portion, sidewalls extending downwardly from the top portion to a backside of the semiconductor device, an inlet opening, and an outlet opening. The top portion, the sidewalls, and the backside of the semiconductor device collectively define a coolant chamber volume therebetween. The inlet opening and the outlet opening are disposed in the top portion and are in fluid communication with the coolant chamber volume. The inlet opening is disposed above a hotspot region of the semiconductor device.

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