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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12363921 B1

PDFFull Text
Date of Patent:
Jul. 15, 2025

Filed:

Apr. 28, 2023

Method for fabricating inductor module

Applicant:

United Microelectronics Corporation, Hsinchu, TW;

Inventors:

Purakh Raj Verma, Singapore, SG;

Su Xing, Singapore, SG;

Shyam Parthasarathy, Singapore, SG;

Xiao Yuan Zhi, Singapore, SG;

Assignee:

UNITED MICROELECTRONICS CORPORATION, Hsinchu, TW;

Attorneys:

Yuan-Te Fu

YUAN-TE FU

Primary Examiner:

Thanhha S Pham

Int. Cl.
CPC ...
H10D 1/20 (2025.01); H01L 21/768 (2006.01);
U.S. Cl.
CPC ...
H10D 1/20 (2025.01); H01L 21/76831 (2013.01); H01L 21/76832 (2013.01); H01L 21/76897 (2013.01);
Abstract

A method for fabricating an inductor module includes steps of: providing a substrate; forming a first inter-level dielectric layer on the substrate; forming a plurality of second inter-level dielectric layers on the first inter-level dielectric layer; forming a trench penetrating at least two of the second inter-level dielectric layers; and forming a first metal layer in the trench.

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Quick Actions:

Verma, Purakh. (2025). Method for fabricating inductor module (U.S. Patent No. 12363921). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12363921

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