The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 15, 2025

Filed:

Dec. 04, 2023
Applicant:

Applied Materials, Inc., Santa Clara, CA (US);

Inventors:

Chien-Teh Kao, Sunnyvale, CA (US);

Tae Kyung Won, San Jose, CA (US);

Carl A. Sorensen, Morgan Hill, CA (US);

Sanjay D. Yadav, Morgan Hill, CA (US);

Young Dong Lee, Hwaseong-Si, KR;

Shinichi Kurita, San Jose, CA (US);

Soo Young Choi, Fremont, CA (US);

Assignee:

Applied Materials, Inc., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C23C 16/452 (2006.01); C23C 16/455 (2006.01); C23C 16/505 (2006.01); C23C 16/52 (2006.01); H01J 37/32 (2006.01); H01L 21/02 (2006.01); H01L 21/683 (2006.01);
U.S. Cl.
CPC ...
H01J 37/32449 (2013.01); C23C 16/45565 (2013.01); C23C 16/505 (2013.01); C23C 16/52 (2013.01); H01J 37/321 (2013.01); H01J 37/32174 (2013.01); H01J 37/32458 (2013.01); H01J 37/32715 (2013.01); H01L 21/02274 (2013.01); H01L 21/6833 (2013.01); H01J 2237/3321 (2013.01);
Abstract

Embodiments of the present disclosure include methods and apparatus for depositing a plurality of layers on a large area substrate. In one embodiment, a processing chamber for plasma deposition is provided. The processing chamber includes a showerhead and a substrate support assembly. The showerhead is coupled to an RF power source and a ground and includes a plurality of perforated gas diffusion members. A plurality of plasma applicators is disposed within the showerhead, wherein one plasma applicator of the plurality of plasma applicators corresponds to one of the plurality of perforated gas diffusion members. Further, a DC bias power source is coupled to a substrate support assembly.


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