The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 08, 2025
Filed:
Oct. 18, 2021
Ebara Corporation, Tokyo, JP;
Yasuyuki Masuda, Tokyo, JP;
Masaki Tomita, Tokyo, JP;
EBARA CORPORATION, Tokyo, JP;
Abstract
Provided is a technique that ensures suppressing deterioration of a plating quality of a substrate caused by gas bubbles accumulating on an entire lower surface of a membrane. A plating process method includes a step of guiding an anode liquid to a second region Rpositioned below a membraneand above a first region Rto decrease a concentration of gas bubbles contained in the anode liquid in the second region below a concentration of gas bubbles contained in the anode liquid in the first region; a step of discharging the anode liquid from the first region; a step of discharging the anode liquid from the second region; a step of supplying a cathode liquid to a cathode chamberin which a substrate Wf is disposed; and a step of flowing electricity between the substrate Wf and an anodeto electroplate a metal on the substrate.