The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 08, 2025
Filed:
Mar. 10, 2021
Applicant:
Ebara Corporation, Tokyo, JP;
Inventors:
Yasuyuki Masuda, Tokyo, JP;
Masashi Shimoyama, Tokyo, JP;
Assignee:
EBARA CORPORATION, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C25D 17/02 (2006.01); C25D 5/02 (2006.01); C25D 17/00 (2006.01); C25D 17/06 (2006.01); C25D 21/10 (2006.01); C25D 21/12 (2006.01);
U.S. Cl.
CPC ...
C25D 17/02 (2013.01); C25D 5/022 (2013.01); C25D 17/001 (2013.01); C25D 17/008 (2013.01); C25D 17/06 (2013.01); C25D 21/10 (2013.01); C25D 21/12 (2013.01);
Abstract
To improve uniformity of a plating film-thickness formed on a substrate. A plating moduleincludes a plating tankfor housing a plating solution, a substrate holderfor holding a substrate Wf, an anodehoused within the plating tank, an anode maskarranged between the substrate Wf held by the substrate holderand the anodeand provided with an openingin a center, and an ionically resistive elementarranged at an interval from the anode maskbetween the substrate Wf held by the substrate holderand the anode maskand provided with a plurality of holes.